Precision electronic components (such as PCB circuit boards, chips, connectors, sensors, etc.) have the characteristics of small structure, material sensitivity (such as plastic packaging, precision solder joints), fear of static electricity, and fear of corrosion. Their dedicated cleaning and testing machines need to have the following special functions: firstly, precise and controllable cleaning function, using high-frequency ultrasonic (80-200kHz) cleaning technology to generate small cavitation bubbles that penetrate into the gaps of the components (such as pin gaps below 0.05mm) to remove welding residues, dust, and other impurities. At the same time, they are equipped with power adjustable function to adjust the ultrasonic power according to the precision of the components, avoiding damage to the pins and packaging structure; Adopting a closed-loop temperature control system, the cleaning temperature is precisely controlled at 30-40 ℃ to prevent deformation of component packaging or damage to internal circuits caused by high temperatures; Equipped with a high-purity cleaning solution circulation filtration system, with a filtration accuracy of less than 1 μ m, to avoid secondary contamination of components by impurities in the cleaning solution. The second is the low damage detection function, which adopts a high-resolution visual inspection module (pixels ≥ 20 million), combined with a macro lens and a circular light source, to accurately detect small problems such as pin deformation, solder joint defects, and circuit short circuits; Non contact detection methods (such as visual and laser) are used during the detection process to avoid physical damage to components caused by contact detection; Equipped with static electricity protection detection function, real-time monitoring of equipment static electricity value, ensuring that the static voltage during the detection process is ≤ 100V, and avoiding static electricity breakdown of components. The third is environmental protection and safety functions, using specialized electronic cleaning agents that are phosphorus free, low VOCs, and high insulation to avoid corrosive components or affecting subsequent welding; Equipped with a sealed cleaning chamber and exhaust gas treatment device to reduce the harm of cleaning agent volatilization to the environment and operators; Set up static grounding devices to prevent equipment from generating static electricity. The fourth is automation and protection functions, integrating automatic loading and unloading robotic arms to avoid pollution and electrostatic damage caused by manual contact; Equipped with workpiece positioning calibration device to ensure accurate component detection position; Set the automatic shutdown function for faults. When the concentration, temperature, or detection accuracy of the cleaning solution is abnormal, the equipment will automatically shut down and sound an alarm to protect the components from damage.
The following taboos must be strictly followed during operation: firstly, the use of ordinary water-based or alkaline cleaning agents is prohibited, as such cleaning agents may corrode component packaging and cause circuit short circuits; Prohibit the use of cleaning agents containing toxic and harmful substances such as fluorine and benzene, which not only pollute the environment but may also damage component materials. Secondly, it is prohibited to arbitrarily increase the ultrasonic power and cleaning temperature. Excessive power can cause deformation of component pins and cracking of packaging, while excessive temperature can damage the internal circuit of the component. Thirdly, it is prohibited to operate equipment without grounding, as the static electricity generated by the equipment can penetrate precision components such as chips and sensors; Operators are prohibited from touching workpieces without wearing anti-static gloves or wristbands, as human static electricity can cause irreversible damage to components. Fourthly, it is prohibited to open the protective doors of the cleaning chamber or detection area during equipment operation, which may not only cause splashing of cleaning agents and injury to operators, but also introduce dust pollution to the workpiece and interfere with detection accuracy. Fifthly, it is prohibited to directly send workpieces with moisture into the inspection area. Moisture can affect the image quality of visual inspection and may also cause component short circuits; Prohibit placing unrelated objects in the detection area to avoid obstructing the detection lens or interfering with sensor signals. Sixth, it is prohibited to arbitrarily modify detection parameters and linkage logic. Parameter deviations can lead to misjudgment of detection results, which may result in unqualified components flowing into the next process and affecting product quality.